Product Details

Single-component self-etch adhesive system One-step, light-curable application for efficient workflow Ideal for bonding direct composite resins to a wide range of dental surfaces including: Dentin and enamel Zirconia and alumina Noble metals and alloys Porcelain and lithium disilicate Other resin materials Ultra-low film thickness of just 5.5 microns ensures optimal fit and aesthetics Compatible with light-cured, dual-cured, and self-cured composites—no additional activator required Delivers high bond strengths to both direct and indirect substrates